Full turnkey operation from PCB design to PCB manufacture to component procurement to PCB assembly on request.
PCB CAPABILITIES
PCB WORLD SOLUTIONS
GENERAL
MATERIAL
DIMENSION & THICKNESS
Hole Diameter Tolerance
PTH ◆
NPTH ◆
◆ ± 0.076mm (± 3mil)
◆ ± 0.051mm (± 2mil)
Maximum Countersink Diameter (When Top Angle is 165 ̊)
◆ 6.35mm (0.25")
HOLE & SLOT
Slot Width
Minimum ◆
◆ 0.5mm (0.020")
◆ 0.102mm (3oz)
◆ 0.012mm (1/3oz)
Base Copper Thickness of Outer Layer
Maximum ◆
Minimum ◆
Maximum Aspect Ratio of Plated Hole
◆ 8 : 1
Base Copper Thickness of Inner Layer
Maximum ◆
Minimum ◆
◆ 0.175mm (5oz)
◆ 0.017mm (1/2oz)
COPPER THICKNESS
Number of Layers
1-20 layers
◆ Gold finger
◆ Tented Via
◆ Blind & Buried Via
◆ Impedance Control
◆ Carbon Ink
◆ Peelable Mask / Kapton
◆ Counter Sink
Special Treatment
Base Material
◆ CEM-3
◆ FR-4 (TG > 130 °C, 150 °C, 170 °C)
◆ FR-4 (Halogen-free)
◆ KB-6160
◆ S1141
◆ IT-140, IT-158, IT-180
Current Suppliers
KINGBOARD ◆
SHENGYI ◆
ITEQ ◆
Board Thickness
Maximum ◆
Minimum ◆
◆ 3.2mm (0.126")
◆ 0.4mm (0.016")
◆ 584 X 813mm (23 X 32")
Board Size
Maximum ◆
◆ ± 10%
◆ ± 0.076mm (± 3mil)
Finished Board Thickness Tolerance
Board Thickness ≥ 0.8 mm ◆
0.4 mm ≤ Board Thickness < 0.8 mm ◆
◆ 0.1mm (0.0039")
Minimum Core Thickness
◆ ± 0.076mm (± 3mil)
Minimum Dielectric Thickness of Inner Layer
Maximum Warp & Twist
◆ 0.7%
Drilling Diameter
Maximum ◆
Minimum ◆
◆ 6.4mm (0.252")
◆ 0.20mm (0.0079")
Finished Diameter
Minimum ◆
◆ 0.102mm (4mil)
Minimum Hole to Hole Distance
◆ 0.305mm (12 mil)
◆ ± 0.076mm (± 3mil)
◆ ± 0.102mm (± 4mil)
◆ ± 0.076mm (± 3mil)
◆ ± 0.204mm (± 8mil)
◆ ± 0.152mm (± 6mil)
Hole Position Tolerance
Compared with CAD data ◆
Hole to Hole with Ф < 1.0mm ◆
Hole to Hole with Ф ≥ 1.0mm ◆
Hole to Edge with Ф < 1.0mm ◆
Hole to Edge with Ф ≥ 1.0mm ◆
Slot Tolerance
PTH with Length ≥ 2 X Width + 0.15mm ◆
PTH with Length < 2 X Width + 0.15mm ◆
NPTH ◆
◆ ± 0.102mm (± 4mil)
◆ ± 0.127mm (± 5mil)
◆ ± 0.076mm (± 3mil)
◆ ≥ 0.020mm (≥ 0.8mil)
Copper Thickness of PTH Wall (SMOBC)
◆ 0.089mm / 0.089mm (3.5mil / 3.5mil)
◆ 0.089mm / 0.089mm (3.5mil / 3.5mil)
◆ 0.102mm / 0.102mm (4mil / 4mil)
◆ 0.127mm / 0.127mm (5mil / 5mil)
◆ 0.152mm / 0.152mm (6mil / 6mil)
Minimum Design Line Width / Space in Outer Layer
T / T oz (1/3oz) ◆
H / H oz (1/2oz) ◆
1 / 1 oz ◆
2 / 2 oz ◆
3 / 3 oz ◆
◆ 0.089mm / 0.089mm (3.5mil / 3.5mil)
◆ 0.102mm / 0.102mm (4mil / 4mil)
◆ 0.127mm / 0.127mm (5mil / 5mil)
◆ 0.152mm / 0.152mm (6mil / 6mil)
◆ 0.229mm / 0.229mm (9mil / 9mil)
Minimum Design Line Width / Space in Inner Layer
H / H oz (1/2oz) ◆
1 / 1 oz ◆
2 / 2 oz ◆
3 / 3 oz ◆
5 / 5 oz ◆
◆ ± 10%
◆ ± 20%
Tolerance After Etching
H / H oz (1/2oz) ◆
1 / 1 oz ◆
◆ ± 5Ω
◆ ± 10%
Impedance Tolerance
≤ 50 Ω ◆
> 50 Ω ◆
CIRCUITRY
◆ ± 0.127mm (± 5mil)
◆ ± 0.102mm (± 4mil)
◆ ± 0.152mm (± 6mil)
◆ ± 0.254mm (± 10mil)
Position Tolerance (Minimum)
Image to Image ◆
Image to Hole ◆
Image to Outline (Outer Layer) ◆
Image to Outline (Inner Layer) ◆
SOLDERMASK
◆ Green (Matt or Glossy)
◆ Black (Matt or Glossy)
◆ White
◆ Blue
◆ Red
◆ Yellow
Colours
◆ ± 0.05mm (± 2mil)
Soldermask Registration
◆ 10μm
Minimum Soldermask Thickness
◆ Soldermask in Hole
◆ Solder Ball on One Side
◆ No Solder Ball
Soldermask Plugging Hole Diameter
Ф > 0.75mm ◆
0.55mm > Ф ≥ 0.75mm ◆
Ф ≤ 0.55mm ◆
◆ 0.076mm (3mil)
Minimum Soldermask Bridge
LEGEND
◆ White
◆ Black
◆ Yellow
Colours
◆ 0.102mm (4mil)
Legend Registration
◆ 0.635mm (25mil)
◆ 0.381mm (15mil)
Legend on Circuit
Height ◆
Width ◆
◆ 0.102mm (4mil)
Legend Line Width
◆ 0.559mm (22mil)
◆ 0.330mm (13mil)
Legend on Large Copper or Lamination
Height ◆
Width ◆
◆ 0.127mm (5mil)
Minimum Letter Width of Soldermask Opening
◆ 2.54 - 5μm (102 - 200μin)
◆ 0.0254 - 0.102μm (1 - 4μin)
Thickness for ENIG (Measured at the Minimum Point)
Nickel (Ni) ◆
Gold (Au) ◆
◆ 0.15 - 0.3μm (6 - 12μin)
Thickness for Immersion Silver
(Measured at the Minimum Point)
Silver (Ag) ◆
PLATING
◆ 0.5 - 1.0μm (20 - 40μin)
Thickness for Immersion Tin
(Measured at the Minimum Point)
Tin (Sn) ◆
◆ 0.2 - 0.3μm (8 - 12μin)
Thickness for OSP (Measured at the Minimum Point)
◆ 20Ω / cm2
Carbon Ink Resistance
◆ 0.375mm (15mil)
Minimum Space for Carbon Conductor
◆ 0.076mm (3mil)
◆ 0.203mm (8mil)
Minimum Test PAD Width
Flying Probe Machine ◆
E-tester Machine ◆
◆ 0.05mm (2mil)
Minimum AOI Test Line
E-Test
◆ 620 X 650mm (24.4 x 25.6")
Maximum AOI Test Dimension
Outline (Punching / Routing / V-cut)
◆ ± 0.102mm (± 4mil)
◆ ± 0.102mm (± 4mil)
Minimum Routing Dimension Tolerance
Edge to Edge ◆
Hole to Edge ◆
◆ ± 0.203mm (± 8mil)
◆ ± 0.178mm (± 7mil)
Minimum Punching Dimension Tolerance
Edge to Edge ◆
Hole to Edge ◆
◆ 0.61mm (24mil)
Minimum Board Thickness that can be V-cut
◆ 0.40mm (16mil)
Minimum Radius by Routing (Internal Angle)
◆ 457mm (18")
Maximum Distance between V-cut and Board Edge
◆ ± 5 ̊
◆ ± 0.102mm (± 4mil)
◆ ± 0.127mm (± 5mil)
◆ ± 0.152mm (± 6mil)
◆ ± 0.127mm (± 5mil)
V-cut Tolerance (Minimum)
Angle (30 ̊ - 60 ̊) ◆
Remaining Thickness ◆
Mis-Registration ◆
V-cut to Hole ◆
V-cut to V-cut ◆