• Board Finishing Type: Hot Air Leveling, Soft Gold, Hard Gold, Immersion Gold, Gold Fingers, Carbon Ink, Immersion Silver and Immersion Tin.
  • Number of Layers: Up to 40 layers available for Rigid PCB’s and 6 layers for Flexible and Rigid-Flex.
  • Available Laminates: FR4, FR5, G-10, Cem3, Polyamide, Rogers, Teflon, Arlon, FR4-High TG Tyconic.
  • Min Finished Hole Size: 0.10mm (4mil).
  • Board Thickness: 0.30 - 5.0mm.
  • Line Width / Spacing: 0.0625mm (2.5mil).
  • Gold Thickness: .025m to 0.4 micron.
  • Gold Fingers: 0.076m to 1.5 microns
  • Nickel Thickness: 2.54 microns - 7.6 microns
  • Soldermask Ink: LPI soldermask in green, red, black, blue, yellow or white, Peelable Soldermask and UV Soldermask also available.
  • Component Overlay: White, yellow or black.
  • Board Profile: NC-Drill, NC-Rout, V-Cut or routed arrays and Edge Bevelling.
  • Special Technology: Blind / Buried via, BGA and Impedance Control and Heavy Copper to 6oz.
  • Testing: High voltage testing for open / shorts and isolation resistance testing.

Full turnkey operation from PCB design to PCB manufacture to component procurement to PCB assembly on request.

Product Type Key Item Now 2011 2012 2013
Multilayer PCB(Rigid) Max Layer count 40 40 40 40
Line width/spacing for inner layer(mil) 2.5 / 2.5 2.5 / 2.5 2.0/2.0 2.0/2.0
Line width/spacing for outer layer(mil) 2.5 / 2.5 2.5 / 2.5 2.0/2.0 2.0/2.0
Max Aspect Ratio 22:1 22:1 24:1 26:1
Min Mechanical Drill size(mil) 4 3 3 3
Min Spacing between via to Conductor(mil) 5 4.8 4.5 4.5
HDI PCB 1+C+1 M M M M
2+C+2 P M M M
3+C+3 R&D S S M
ALIVH / R&D R&D S
Min laser drill size(mil) 3 3 2.5 2
Min pad size of laser hole(mil) 8 8 7.5 7
Max Aspect Ratio(laser hole) 1.1:1 1.2:1 1.2:1 1.2:1
Rigid-Flex PCB Max Layer count 20 26 30 40
Line width/spacing for inner layer(mil) 3.5/3.5 3 / 3 2.5/2.5 2.5 / 2.5
Line width/spacing for outer layer(mil) 3.5/3.5 3 / 3 2.5/2.5 2.5 / 2.5
Max Aspect Ratio 10:1 12:1 16:1 16:1
Min Mechanical Drill size(mil) 8 8 6 6
Min Spacing between via to Conductor(mil) 7 7 6.5 6.5
Special Technics Metal based PCB aluminium& Copper aluminium& Copper aluminium& Copper aluminium& Copper
Depth tolerance of Metal matrix?mm? 0.05 0.03 0.03 0.03
Tolerance for depth controlled board(mm) 0.13 0.10 0.10 0.10
Impedance Control 7% 7% 5% 5%
Heavy Copper(OZ) 10 10 10 10
Heatsink Board?The technology of press by No-flow PP? P M M M
Heatsink Board?Sweat bonding? S&P M M M
?DBC?PCB S&P M M M
Embedded metal PCB R&D S&P M M
Embedded capacitance PCB R&D M M M
Embedded resistance PCB S&P S&P M M
Local high frequency Circuit boards S&P M M M
Microvia filling by plating S&P M M M
Epoxy plugging (conductive/non-conductive) M M M M
NOTE R&D? Research and development?S?Sample?
P?low volume production?M?Mass Production
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PCB World Solutions Pty Ltd, U1-45 Douglas Drive, Technology Park, Mawson Lakes. S.A.5095
Phone (7 days):(08) 8260 3799 Mobile: 0423 968 590 Fax: (08) 8260 3899 Email. sales@pcbws.com.au
ACN 099 310 684 ABN 80 167 720 426